High-capacity memory card and method of making the same
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United States of America Patent
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Feb 16, 2010
Grant Date -
Jan 25, 2007
app pub date -
Jul 25, 2005
filing date -
Jul 25, 2005
priority date (Note) -
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Abstract
A memory card assembly with a simplified structure. The memory card assembly has a memory card assembly a printed wiring board substrate and at least one integrated circuit unit mounted and electrically connected to the printed wiring board substrate. A rigid ring is fitted over a periphery of the printed wiring board substrate to encircle the integrated circuit die therein. Thereby, a dam with an open top is constructed over the printed wiring board substrate. A filler resin material is then filled within the open dam to cover the printed wiring board substrate and integrated circuit unit.
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