Wire bonding method
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United States of America Patent
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Feb 16, 2010
Issued Date -
N/A
app pub date -
Sep 10, 2008
filing date -
Jun 27, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.
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