Cutting segment for diamond tool and diamond tool having the segment
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United States of America Patent
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Feb 16, 2010
Grant Date -
Jul 17, 2008
app pub date -
Apr 20, 2006
filing date -
Apr 20, 2005
priority date (Note) -
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Abstract
The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
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