Method and apparatus for ultrasonic scanning of a fabrication wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 16, 2010
Grant Date -
Nov 24, 2005
app pub date -
May 24, 2004
filing date -
May 24, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for ultrasonic scanning of a wafer assembly is disclosed. The wafer assembly is held in a wafer chuck and rotated. A transducer generates ultrasound in the wafer assembly and the ultrasound emitted from the wafer assembly is sensed. A controller adjusts the relative positions of the wafer and the transducer and controls the transducer to generate ultrasound at a number of scan points.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully