Method of packaging a semiconductor device and a prefabricated connector
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United States of America Patent
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Feb 2, 2010
Grant Date -
Nov 19, 2009
app pub date -
Jul 28, 2009
filing date -
Nov 17, 2006
priority date (Note) -
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Abstract
A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer; forming a first dielectric layer over the first major surface of the first device, forming a via in the first dielectric layer, forming a seed layer within the via and over a portion of the first dielectric layer, physically coupling a connector to the seed layer, and plating a conductive material over the seed layer to form a first interconnect in the first via and over a portion of the first dielectric layer.
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