Semiconductor device including main substrate and sub substrates
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United States of America Patent
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Jan 26, 2010
Grant Date -
May 14, 2009
app pub date -
Jun 10, 2008
filing date -
Nov 14, 2007
priority date (Note) -
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Abstract
A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.
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