Electromagnetic shield formation for integrated circuit die package

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United States of America Patent

PATENT NO 7651889
APP PUB NO 20090075428A1
SERIAL NO

11961827

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN XINGUODU TECHNOLOGY CO LTD17TH FLOOR JINSONG MANSION TERRA INDUSTRIAL & TRADE PARK FUTIAN SHENZHEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Booth, Robert E Austin, US 9 477
Burch, Kenneth R Austin, US 34 853
Frear, Darrel Phoenix, US 4 412
Herr, Lawrence N Coupland, US 10 270
Lin, Jong-Kai Chandler, US 14 614
Mangrum, Marc A Manchaca, US 17 570
Tang, Jinbang Chandler, US 45 639

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