Die design with integrated assembly aid
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United States of America Patent
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Jan 19, 2010
Grant Date -
Apr 16, 2009
app pub date -
Feb 7, 2008
filing date -
Nov 14, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
Methods and systems for inserting and replacing swaged probe pins in a lower die portion of a head having an array of micro-holes for receiving the probe pins are disclosed. The methods and systems include the following: swaged probe pins including substantially cylindrical ends and a swaged center portion; and an assembly aid film including an array of slotted holes, each of the slotted holes including a substantially round portion for receiving the substantially cylindrical ends of the swaged probe pins and slot portions for receiving the swaged center portion of the swaged probe pins. The array of slotted holes is configured to properly align the swaged probe pins with the array of micro-holes.
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