Probe and method of manufacturing probe
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United States of America Patent
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Jan 19, 2010
Grant Date -
Feb 14, 2008
app pub date -
Mar 3, 2005
filing date -
Mar 5, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
In accordance with an increase in speed, a wiring structure has rapidly become more microscopic and thinner and a wiring layer has become extremely thin, and therefore, giving a contact load to a probe for the inspection as has been conventionally done causes damage to a wiring layer and an insulation layer because the probe penetrates not only the oxide film but also the wiring layer or because of a concentration stress from the probe. On the other hand, decreasing the contact load causes unstable continuity between the probe and an electrode pad.It is an object of the present invention to surely and stably inspect an object to be inspected by breaking an oxide film with a low stylus pressure.The present invention is a probe that comes into electrical contact with an object to be inspected when inspecting an electrical characteristic of the object to be inspected, the probe including: a probe main body having a contact portion that comes into contact with the object to be inspected; and a plurality of conductive materials having tip portions projecting from the contact portion of the probe main body.
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