Method of forming flexible electronic circuits
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United States of America Patent
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Jan 19, 2010
Grant Date -
Aug 21, 2008
app pub date -
Mar 24, 2006
filing date -
Apr 22, 2005
priority date (Note) -
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Abstract
A multiple layer photosensitive element having at least three differently sensitised photosensitive layers on one side of a support, such as a, transparent flexible support, is imagewise exposed according to a desired circuit pattern and developed to form two layers of conductive track patterns from each photosensitive layer, which may then be connected together by forming vias by drilling or in situ generation. The resulting multiple layer conductive element has application in the field of printed circuit board manufacture or as the backplane electronic element of a flexible display device.
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