Low dielectric loss composite material

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United States of America Patent

PATENT NO 7648758
APP PUB NO 20080187734A1
SERIAL NO

11671698

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Abstract

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Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.

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Patent Owner(s)

Patent OwnerAddress
QUANTUM MATERIALS LLC5280 NATIONAL CENTER DRIVE COLFAX NC 27235

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morin, Brian G Greenville, US 89 638

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