Method and apparatus for treating a substrate
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United States of America Patent
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Jan 12, 2010
Grant Date -
Oct 19, 2006
app pub date -
Dec 12, 2003
filing date -
Dec 12, 2002
priority date (Note) -
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Abstract
A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.
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