Inverted lead frame in substrate
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United States of America Patent
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Jan 5, 2010
Grant Date -
Jun 26, 2008
app pub date -
Dec 19, 2007
filing date -
Dec 22, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package, and method of making a semiconductor package, with a plurality of dies, wherein one die is attached to an inverted lead frame and another die is attached to a substrate. The leadframe is then attached to the substrate. More specifically, the semiconductor package includes a substrate, a lead frame and a plurality of leads. The lead frame is attached to the top surface of the substrate. The bottom surface of a first die is attached to the top surface of the substrate and the first die is electrically connected to the substrate. The top surface of a second die is attached to the bottom die pad surface of the lead frame and the second die is electrically connected to the leadframe. An encapsulant covers at least a portion of the lead frame and substrate.
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