MEMS packaging with improved reaction to temperature changes
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United States of America Patent
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Jan 5, 2010
Grant Date -
Jul 13, 2006
app pub date -
Jan 11, 2005
filing date -
Jan 11, 2005
priority date (Note) -
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Abstract
A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.
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