Electro-optic device packages
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United States of America Patent
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Jan 5, 2010
Grant Date -
Oct 29, 2009
app pub date -
Apr 29, 2008
filing date -
Apr 29, 2008
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Abstract
A package design for electro-optic devices has been developed in which the substrate supporting the electro-optic element serves also as the base of the device housing. The electro-optic element is flip-chip bonded to the substrate. In a preferred embodiment the substrate is a multi-level wiring board.
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