Soldering method for semiconductor optical device, and semiconductor optical device
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United States of America Patent
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Dec 29, 2009
Grant Date -
Nov 13, 2008
app pub date -
Jul 21, 2008
filing date -
May 18, 2005
priority date (Note) -
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Abstract
A method for soldering a semiconductor optical device including a resin-made optical lens to an object by a reflow soldering process using a lead-free solder, and a semiconductor optical device for use in the method. A semiconductor optical device including a silicone resin-made optical lens as the resin-made optical lens is used.
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