Lapping plate resurfacing abrasive member and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7637802
APP PUB NO 20070054607A1
SERIAL NO

11516634

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loose abrasive grains are fed onto the plate. A synthetic resin-based elastic abrasive member having a Rockwell hardness (HRS) in the range of −30 to −100 is effective for resurfacing the lapping plate.

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Patent Owner(s)

Patent OwnerAddress
SHINANO ELECTRIC REFINING CO LTD1-5 SUDA-CHO KANDA CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kazama, Kenichi Tokyo, JP 22 239
Sato, Shunji Tokyo, JP 21 140
Tsuneya, Ayumi Tokyo, JP 1 9
Yasuoka, Kai Tokyo, JP 3 26

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