Approach for fabricating cantilever probes for probe card assemblies
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United States of America Patent
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Dec 29, 2009
Grant Date -
Aug 30, 2007
app pub date -
Feb 7, 2007
filing date -
Feb 8, 2006
priority date (Note) -
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Abstract
An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.
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