Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip
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United States of America Patent
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Dec 22, 2009
Grant Date -
Mar 20, 2008
app pub date -
Sep 14, 2006
filing date -
Sep 14, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
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