Anisotropic conductive adhesive, electrode connection structure and method using the adhesive
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United States of America Patent
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Dec 22, 2009
Grant Date -
Aug 31, 2006
app pub date -
Jan 23, 2006
filing date -
Jan 31, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.
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