Process and apparatus for thinning a semiconductor workpiece
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United States of America Patent
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Dec 1, 2009
Grant Date -
Sep 14, 2006
app pub date -
May 26, 2006
filing date -
Aug 20, 2004
priority date (Note) -
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Abstract
The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.
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