Method for producing masks for photolithography and the use of such masks
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 1, 2009
Grant Date -
Sep 15, 2005
app pub date -
Feb 22, 2005
filing date -
Feb 25, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mask for photolithography methods comprises opaque and transparent areas as well as a surface structure. For the contact with a substrate (10) to be exposed at least a few opaque areas are incorporated and at least a few transparent areas are arranged in a spaced fashion and are deep-etched down to a structural depth. In a further embodiment at least one transparent area is designed as a positively resting area (12). The structural depth in the deep-etched areas is greater than the thickness of the surface structure, at least greater than or equal to 1 .mu.m.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully