Calibration apparatus for bondhead of wire bonding machine
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United States of America Patent
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Dec 1, 2009
Issued Date -
N/A
app pub date -
Sep 29, 2008
filing date -
Sep 29, 2008
priority date (Note) -
Expired
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Abstract
A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding operation. The wire bonding machine further includes a camera configured to receive images of a portion of the bondhead assembly, the images being used to determine a position where a length of the transducer is substantially parallel to the bonding surface.
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