Flip chip shielded RF I/O land grid array package
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United States of America Patent
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Nov 24, 2009
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N/A
app pub date -
Dec 21, 2006
filing date -
Dec 21, 2006
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Abstract
A novel apparatus and method for providing a radio frequency (“RF”) input/output (“I/O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings surrounding free-standing RF I/O interconnects. The free-standing RF I/O interconnects eliminate long leads and the shield rings provide ground protection thereby minimizing losses, inductance, leakage, and crosstalk, and improving performance.
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