Wafer-level packaging cutting method capable of protecting contact pads
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United States of America Patent
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Nov 24, 2009
Grant Date -
Mar 5, 2009
app pub date -
Apr 9, 2008
filing date -
Aug 30, 2007
priority date (Note) -
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Abstract
A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.
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