Grounding device and method of constructing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7619161
APP PUB NO 20060237213A1
SERIAL NO

11402831

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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is integrated with a foundation member B of a building so that the grounding member E and the foundation member B overlap partly or entirely. The grounding device is configured so that the grounding member having the grounding conductor and the conductive laminated portion covering the grounding conductor is integrated with the foundation member of the building are so that the grounding member and the foundation member overlap partly or entirely. This makes it possible to easily offer a small grounding resistance. Further, the foundation member of the building contacts the earth over a large area. This enables a small grounding resistance to be stably offered for a long period.

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Patent Owner(s)

Patent OwnerAddress
SANKOSHA CORPORATIONTOKYO 141-0032

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishizaki, Makoto Tokyo , JP 16 96
Okabayashi, Chikashi Tokyo , JP 2 14
Yoneda, Minoru Tokyo , JP 17 145

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