Method of packaging and interconnection of integrated circuits
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United States of America Patent
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Nov 17, 2009
Grant Date -
Feb 22, 2007
app pub date -
Aug 18, 2005
filing date -
Aug 18, 2005
priority date (Note) -
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Abstract
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.
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