Method and apparatus for sequential plasma treatment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 17, 2009
Grant Date -
Aug 12, 2004
app pub date -
Apr 24, 2002
filing date -
Apr 27, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for plasma treatment of a non-conductive hollow substrate, including a plurality of ionization energy sources disposed adjacent to each other all along the part of the substrate to be treated. The apparatus also includes a processor to sequentially power the plurality of ionization energy sources from a radio frequency power source. Each ionization energy source includes two parts sandwiching the substrate. The ionization energy sources can be capacitively or inductively coupled plasma sources.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully