Polishing pad for electrochemical mechanical polishing
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United States of America Patent
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Nov 17, 2009
Grant Date -
Dec 1, 2005
app pub date -
May 25, 2004
filing date -
May 25, 2004
priority date (Note) -
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Abstract
The present invention provides polishing pad for electrochemical mechanical polishing. The pad comprises a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm.
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