Method for printing an electronic circuit component on a substrate using a printing machine
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United States of America Patent
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Nov 17, 2009
Grant Date -
Nov 3, 2005
app pub date -
Apr 29, 2005
filing date -
May 3, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of printing an electronic circuit or components thereof uses a printing machine to print a conductive structure on the front printing side (back side of the sheet) of a printing substrate. The sheet is then reversed and a decorative printing motif is printed on the back side in one work step. Alternatively, the circuit or components of a circuit may be printed by having a printing machine for color printing preceded by a printing machine for printing on the back side of the printing substrate. A chip is applied to the printing substrate where the back side of the printing sheet with the printing motif is cooled to prevent any negative effect on the printing motif and/or the printing substrate.
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