Photoresist coating composition and method for forming fine pattern using the same
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United States of America Patent
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Nov 10, 2009
Grant Date -
Nov 23, 2006
app pub date -
Dec 8, 2005
filing date -
May 19, 2005
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Abstract
A photoresist coating composition that includes a compound represented by Formula 1 and an aqueous solvent, and a method for forming a fine pattern by coating the composition on a photoresist pattern to effectively reduce a size of a photoresist contact hole and a space, which can be applied to all semiconductor processes.
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