Polymer dielectrics for memory element array interconnect
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United States of America Patent
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Oct 27, 2009
Grant Date -
Oct 13, 2005
app pub date -
Apr 2, 2004
filing date -
Apr 2, 2004
priority date (Note) -
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Abstract
Disclosed are semiconductor devices containing a polymer dielectric and at least one active device containing an organic semiconductor material and a passive layer. Also disclosed are semiconductor devices further containing a conductive polymer. Such devices are characterized by light weight and robust reliability.
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