Water-permeable adhesive tape
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 27, 2009
Grant Date -
May 17, 2007
app pub date -
Jan 8, 2007
filing date -
Mar 30, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully