Superabsorbent polymer root dip
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United States of America Patent
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Oct 27, 2009
Grant Date -
Jul 19, 2007
app pub date -
Jan 17, 2006
filing date -
Jan 17, 2006
priority date (Note) -
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Abstract
A superabsorbent polymer (“SAP”) root dip composition and methods of delivering a SAP to a plant are disclosed. A root structure of a plant may be dipped into a SAP hydrogel. The plant may then be planted, stored or transported for subsequent planting.
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