Assembly for extracting heat from a housing for electronic equipment
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United States of America Patent
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Oct 20, 2009
Grant Date -
Nov 1, 2007
app pub date -
Apr 27, 2006
filing date -
Apr 27, 2006
priority date (Note) -
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Abstract
An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing.
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