High temperature ceramic socket configured to test packaged semiconductor devices
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United States of America Patent
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Oct 13, 2009
Grant Date -
Dec 25, 2008
app pub date -
Jun 22, 2007
filing date -
Jun 22, 2007
priority date (Note) -
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Abstract
A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole of the single piece socket has therein a separate one of the electrically conductive springs. A test socket includes a plurality of pins configured to receive leads of an integrated circuit, the pins of the test socket extending into the plurality of holes of the single piece socket with each pin engaging a spring, wherein the single piece socket is positioned on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins. The single -piece socket is comprised substantially of a high-temperature insulating material, such as ceramic.
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