Process to control semiconductor wafer yield

United States of America Patent

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Oct 13, 2009
Grant Date
Aug 16, 2007
app pub date
Aug 15, 2006
filing date
Aug 25, 2005

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Expired

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profile across the wafer and significantly reduced BV distribution over the wafer.

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Patent Owner	Address
INTERNATIONAL RECTIFIER CORP	233 KANSAS STREET EL SEGUNDO CA 90245

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Green, Simon	Cardiff , GB	23	141

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Process to control semiconductor wafer yield

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United States of America Patent

11464619

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PATENT NO	7602015
APP PUB NO	20070187754A1
SERIAL NO	11464619
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 13, 2009	US,7602015,B2 US7602015B2	GRANTED PATENT AS SECOND PUBLICATION
August 16, 2007	US,20070187754,A1 US20070187754A1	FIRST PUBLISHED PATENT APPLICATION

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11464619

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