Method for wafer level packaging and fabricating cap structures
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United States of America Patent
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Oct 6, 2009
Grant Date -
Jul 12, 2007
app pub date -
Jun 26, 2006
filing date -
Jan 12, 2006
priority date (Note) -
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Abstract
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the cavities and is segmented around the cavities to form a plurality of cap structures. The cap structures are hermetically sealed to a device wafer to form hermetic windows over devices and pads located on the device wafer.
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