Circuit board and method for its production
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United States of America Patent
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Sep 29, 2009
Grant Date -
Nov 16, 2006
app pub date -
May 11, 2006
filing date -
May 13, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a circuit board and a method for its production. The highly flexible circuit board includes electrically non-conductive threads and electrically conductive threads. These threads form a fabric with a regular mesh structure. In the latter at least electrically conductive threads are used as warp threads and weft threads.
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