Memory device including multiplexed inputs
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United States of America Patent
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Sep 22, 2009
Grant Date -
Nov 15, 2007
app pub date -
May 4, 2007
filing date -
May 4, 2006
priority date (Note) -
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Abstract
Systems and methods are described for reducing the number of exterior contacts on a semiconductor package without reducing the number of address, data and control signals used by an integrated circuit interior to the semiconductor package. In some embodiments, two signals may be received at a shared conductor accessible by devices exterior to the semiconductor package and communicated to two contacts on the integrated circuit that are inaccessible to the exterior of the semiconductor package. In various embodiments, signals required to support a full set of features of the JEDEC JESD79E standard or the JEDEC JESD79-2C standard are communicated using a reduced number of exterior contacts.
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