Apparatus for absorbing and dissipating excess heat generated by a system
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United States of America Patent
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Sep 22, 2009
Grant Date -
Nov 9, 2006
app pub date -
Jul 14, 2005
filing date -
May 5, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a heatsink. More particularly, the invention relates to a heatsink having tapered geometry that improves passive cooling efficiency. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing cooling gas upon heating. Thus, the tapered heatsink elements result in higher velocity of gas flow and increased cooling efficiency of the heatsink. Optionally, the heatsink is made from a thermally conductive polymer allowing the heatsink to be created in complex shapes using injection molding.
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