Side connectors for RFID chip
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United States of America Patent
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Sep 15, 2009
Grant Date -
Feb 7, 2008
app pub date -
Aug 1, 2007
filing date -
Aug 7, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip. The conductive paths including a first side connector on a first side of the chip electrically connected to the first bond pad and a second side connector on a second side of the chip connected to the second bond pad. The first and second side connectors can cover at least half of the first and second side length respectively.
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