Bonding aid for polyamide resin and method of bonding with the same
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United States of America Patent
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Sep 15, 2009
Grant Date -
Apr 20, 2006
app pub date -
Dec 18, 2003
filing date -
Jan 10, 2003
priority date (Note) -
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Abstract
It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined joining face and another polyamide resin when they are joined together, and has a composition containing a compound (1), which cleaves a hydrogen bond in the polyamide resin molded article while assisting the dissolution of the polyamide resin, in an organic solvent capable of dissolving the polyamide resin.
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