Wafer-level testing of optical and optoelectronic chips
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United States of America Patent
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Sep 8, 2009
Grant Date -
N/A
app pub date -
Mar 28, 2007
filing date -
Apr 7, 2003
priority date (Note) -
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Abstract
This application describes, among others, wafer designs, testing systems and techniques for wafer-level optical testing by coupling probe light from top of the wafer.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- G01B:MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIME....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
- G06K:RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD ....
- G01V:GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING ....
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