Method of manufacturing a microelectronic component utilizing a tool comprising an ESD dissipative ceramic
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United States of America Patent
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Aug 25, 2009
Grant Date -
Jan 26, 2006
app pub date -
Jul 20, 2005
filing date -
Nov 21, 2000
priority date (Note) -
Expired
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Abstract
Ohm-cm), substantially pore free, high flexural strength, light colors, for desired ESD dissipation characteristics, structural reliability, high vision recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems.
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