Lead frame structure and applications thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7576418
APP PUB NO 20090121329A1
SERIAL NO

12167622

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.

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Patent Owner(s)

Patent OwnerAddress
ORIENT SEMICONDUCTOR ELECTRONICS LTD9 CENTRAL 3RD ST N E P Z KAOHSIUNG R O C

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, En-Shou Budai Township, Chiayi County, TW 2 8
Chen, Chia-Yu Kaohsiung, TW 118 855
Cheng, I-Chi Kaohsiung, TW 5 71
Pong, Ta-Lin Kaohsiung, TW 1 4
Su, Chen-Ping Kaohsiung, TW 4 4

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