Bonding apparatus and method

United States of America Patent

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Aug 18, 2009
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app pub date
Jun 30, 2006
filing date
Jun 30, 2005

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Abstract

containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.

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Patent Owner(s)

Patent Owner	Address
KABUSHIKI KAISHA SHINKAWA	TOKYO

International Classification(s)

B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

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Inventor Name	Address	# of filed Patents	Total Citations
Fujita, Kazuo	Musashimurayama, JP	58	824
Maeda, Toru	Tachikawa, JP	139	1901

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Bonding apparatus and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11480195

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US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 18, 2009	US,7576297,B2 US7576297B2	GRANTED PATENT AS SECOND PUBLICATION
January 04, 2007	US,20070000878,A1 US20070000878A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7576297
SERIAL NO	11480195
DOCKET NO

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11480195

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