Fabrication method for semiconductor package heat spreaders
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United States of America Patent
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Aug 18, 2009
Grant Date -
May 26, 2005
app pub date -
Nov 24, 2003
filing date -
Nov 24, 2003
priority date (Note) -
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Abstract
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
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