Vacuum fixing jig for semiconductor device

United States of America Patent

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Aug 11, 2009
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Oct 6, 2005
app pub date
Mar 10, 2005
filing date
Oct 19, 2001

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Abstract

gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

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SOCIONEXT INC.

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Inventor Name	Address	# of filed Patents	Total Citations
Hayasaka, Noboru	Kawasaki , JP	30	146
Shimobeppu, Yuzo	Kawasaki , JP	23	197
Shinjo, Yoshiaki	Kawasaki , JP	19	154
Teshirogi, Kazuo	Kawasaki , JP	30	516
Watanabe, Mitsuhisa	Kawasaki , JP	38	341
Yoshida, Eiji	Kawasaki , JP	122	1759
Yoshimoto, Kazuhiro	Kawasaki , JP	31	275

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Vacuum fixing jig for semiconductor device

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United States of America Patent

11075712

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PATENT NO	7571538
APP PUB NO	20050221587A1
SERIAL NO	11075712
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 11, 2009	US,7571538,B2 US7571538B2	GRANTED PATENT AS SECOND PUBLICATION
October 06, 2005	US,20050221587,A1 US20050221587A1	FIRST PUBLISHED PATENT APPLICATION

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11075712

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