Systems and methods for a tilted optical receiver assembly
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United States of America Patent
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Jul 28, 2009
Grant Date -
Mar 12, 2009
app pub date -
Sep 10, 2007
filing date -
Sep 10, 2007
priority date (Note) -
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Abstract
Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.
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